W02 Heterogeneous Integration: from advanced 3D technology to innovative computing architectures

Start

Tue, 1 Apr 2025 08:30

End

Tue, 1 Apr 2025 12:30

General Co-Chair

Pascal Vivet, CEA-LIST, France

Workshop Description

3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration. With the limits of current sub-nanometric technologies, 3D integration technology is paving the way to a wide architecture scope, with reduced cost, reduced form factor, increased energy efficiency, allowing a wide variety of heterogeneous architectures. Due to the high amount of required data and associated memory capacity, ML and AI accelerator could benefit of 3D integration not only for HPC, but also for the edge and embedded HPC. 3D integration and associated architectures are opening a wide spectrum of system solutions, from chiplet-based partitioning for High Performance Computing to various sensors such as fully integrated image sensors embedding AI features, but also but also for next generation of computing architectures: AI accelerators, InMemoryComputing, Quantum, etc.

The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.

This half-day event consists of a plenary keynote, invited talks, and a panel.

Workshop Committee