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• Official contact emails listed here: https://www.date-conference.com/call-for-papers
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If you receive any suspicious message, delete it immediately and mark it as spam.

DATE offers a wealth of exciting opportunities to connect with the DATE community so showcase your innovative solutions and be part of the celebration as DATE 2027  marks its 30th anniversary!

Download the DATE 2027 Promotion & Sponsorship Opportunities here

Join us in celebrating 30 years of DATE! This special anniversary edition offers the perfect opportunity to present and communicate your technological and business capabilities to scientific, industrial and commercial audiences at one of Europe’s leading events in design, automation and test. Companies, institutions, universities, initiatives and projects that join DATE as promotion partners or sponsors benefit from outstanding visibility and valuable opportunities to highlight their corporate identity, products, services, expertise and cause.

The DATE 2027 promotion & sponsorship opportunities brochure gives you and idea of what DATE 2027 can offer. Tailor-made packages can be arranged to suit your special requests. Feel free to contact us to discuss your needs and ideas.

Become part of this special milestone and celebrate 30 years of DATE with us in Dresden! We look forward to welcoming you among our promotion partners and sponsors for an inspiring anniversary edition filled with innovation, exciting encounters, valuable connections and effective networking.

For more details, please contact the

Conference Organisation | Sponsorship
Anja Zeun, K.I.T. Group GmbH, DE
date@kitdresden.de

DATE 2027 marks the 30th edition of Europe's leading conference on design, automation, test, and manufacturing of electronic circuits and systems. For three decades, DATE has been bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test, and manufacturing of electronic circuits and systems. DATE places a strong emphasis on both technology and systems, covering ICs/SoCs, reconfigurable hardware, and embedded systems, as well as embedded software.

The three-day event consists of a conference with regular papers, extended abstracts, and late breaking results, complemented by timely keynotes, special days, focus sessions, embedded tutorials, half-day workshops, and multi-partner project sessions. The event will also host the Young People Programme fostering networking and exchanges of information on relevant issues, recent research outcomes, and career opportunities for junior researchers. Poster-supported live interactions are available to complement all research paper presentations before, during, and after the conference.

As DATE celebrates its 30th anniversary, the conference continues its tradition of being the place where researchers, young professionals, entrepreneurs, and industrial partners meet to discuss current developments, explore emerging trends, and build the collaborations that drive future innovation.

Conference Scope

The conference addresses all aspects of research into technologies for electronic and systems engineering. It covers the design process, test, and tools for design automation of electronic products, ranging from integrated circuits to distributed large-scale systems. This domain includes both hardware and embedded software design issues. The conference scope also includes the specification of design requirements and new architectures for challenging application fields such as sustainable computing, smart societies and digital wellness, secure systems, autonomous systems and smart industry, and state-of-the-art applications of artificial intelligence. Engineers, scientists, and researchers involved in innovative industrial designs are particularly encouraged to submit papers to foster feedback ranging from design to research aspects.

Conference Sponsors

The event is sponsored by the European Design and Automation Association (EDAA), the Electronic System Design Alliance (ESDA), the IEEE Council on Electronic Design Automation (IEEE CEDA) and the ACM Special Interest Group on Design Automation (ACM SIGDA), and organized in cooperation with IEEE Solid-State Circuits Society (SSCS), IEEE Computer Society Test Technology Technical Community (TTTC) and IEEE Computer Society (IEEE CS).

Conference Committees

The conference leverages the support of multiple committees to support its organisation. The DATE Sponsors Committee supervises the overall structure and operations of the conference; the Executive Committee designs and implement the yearly programme of the conference, and the Technical Programme Committee is dedicated to develop reviews and select the research manuscripts to be published at the conference.

• DATE Sponsors Committee (DSC)
• DATE Executive Committee (DEC)
• Technical Programme Committee (TPC)

Contacts

Conference Organisation | Conference Manager
Anja Zeun, K.I.T. Group GmbH Dresden, DE
date@kitdresden.de

General Chair
Robert Wille, Technical University Munich, DE
robert.wille@tum.de

Programme Chair
Lukas Sekanina, Brno University of Technology, CZ
papers@date-conference.com

To receive the DATE 2027 newsletter you may subscribe to the mailing list at the website: https://www.date-conference.com/#block-simplenewssubscription.

EDAA Achievement Award 2026

Krishnendu Chakrabarty, Arizona State University, US

in recognition of outstanding contributions to EDA and its community.

https://date26.date-conference.com/edaa-achievement-award-2026-goes-kri…

IEEE CEDA Outstanding Service Recognition Award

Aida Todri-Sanial, Eindhoven University of Technology, NL

for outstanding contributions to DATE as General Chair of DATE 2025

IEEE CEDA Distinguished Service Award

David Atienza, EPFL, CH

for distinguished service to the EDA community and the IEEE Council on EDA

IEEE CS TTTC Outstanding Contribution Award

Valeria Bertacco, University of Michigan, US

for outstanding contributions to DATE as General Chair of DATE 2026

IEEE CS TTTC Outstanding Contribution Award

Wolfgang Müller, Paderborn University, DE

for exceptional contributions to DATE

Young People Programme – PhD Forum Best Poster Award

Side-Channel Awareness in Neural Network FPGA Accelerators: Security Threats and Opportunities for Functional Safety

Vincent Meyers, Karlsruhe Institute of Technology, DE

Generative AI in the Hardware Design Flow: from High-Level Synthesis to Security

Luca Collini, New York University, US

EDAA Outstanding Dissertation Awards

Topic 1 New directions in systems design methods and tools, simulation and validation, embedded software design and optimization for embedded, cyber-physical, secure and learning systems

Learning-Based Methods for Enabling On-Edge, Accurate, Sustainable, and Kuman Centered Intelligent Manufacturing

Luigi Capogrosso, Politecnicodi Torino, IT

Advisors: Marco Cristani, Franco Fummi

Topic 2 New directions in SoC platforms co-design, novel architectures for future computing in design flows, and power management

AI-driven Design and Optimization of Heterogeneous ChipletSystems for Server-Scale AI Workloads

Harsh Sharma, Washington State University, US

Advisors: Partha Pande, Jana Doppa

Topic 3 New directions in logic, physical design and CAD for analog/mixed-signal,nano-scale and emerging technologies

Equality Saturation for Circuit Synthesis and Verification

Samuel Coward, Imperial College London, UK

Advisor: George Constantinides

Topic 4 New directions in safety, reliability and security-aware hardware design, validation and test

Hardware-Firmware Security Co-Verification

Aruna Jayasena, University of Florida, US

Advisor: Prabhat Mishra

SIGDA PhD Dissertation Award 2026

Technology Mapping and Optimization Algorithms for Logic Synthesis of Advanced Technologies

Alessandro Tempia Calvino, École Polytechnique Fédérale de Lausanne, CH

Advisor: Giovanni De Micheli

SIGDA Outstanding New Faculty Award 2026

Meng Li

Assistant Professor
Peking University, CN

DATE Fellow Award

Aida Todri-Sanial, Eindhoven University of Technology, NL

for outstanding service contribution for DATE asGeneral Chair of DATE 2025

Best Paper Awards

D_low Track Design Methods and Tools

FSDB: A Folded-Store Dynamic-Broaden Hybrid Compute-in-ROM/SRAM Architecture for Deploying Large-Scale DNNs On-Chip

Tianyi Yu, Teng Yi, Huazhong Yang and Xueqing Li, Tsinghua University, CN
(Session BPA01)

D_high Track Design Methods and Tools

Torrent: A distributed DMA for Efficient and Flexible Point-to-Multipoint Data Movement

Yunhao Deng1, Fanchen Kong2, Xiaoling Yi2, Ryan Antonio3 and Marian Verhelst2, 1MICAS - KU Leuven, BE; 2KU Leuven, BE; 3MICAS KU Leuven, BE
(Session BPA02)

A Track Application Design

INSPIRE: In-Sensor Compressed Weight Retrieval for Enhancing ViTEfficiency at Edge

Sabbir Ahmed1, Deniz Najafi2, Mohaiminul Al Nahian1, Navid Khoshavi3, Abdullah Al Arafat4, Mamshad Nayeem Rizve5, Mahdi Nikdast6, Adnan Siraj Rakin7 and Shaahin Angizi2, 1Binghamton University (SUNY), US; 2New Jersey Institute of Technology, US; 3AMD, US; 4Florida International University, US; 5Adobe, US; 6Colorado State University, US; 7Binghamton University, US
(Session BPA03)

T Track Test and Dependability

RIFT: A Scalable Methodology for LLM Accelerator Fault Assessment using Reinforcement Learning

Khurram Khalil, Muhammad Mahad Khaliq and Khaza Anuarul Hoque, University of Missouri, US
(Session BPA04)

E Track Embedded Systems Design

KirbyMM: Outer-Product Based Matrix Multiplication on ARMv9 Processor

LanshuHuang, Han Huang, ZhiguangChen and Yutong Lu Sun, Yat-sen University, CN
(Session BPA02)

Outstanding Reviewer Awards

D Track

Lorenzo Ferretti, Micron Technology, US

Siting Liu, ShanghaiTech University, CN

Yukai Chen, IMEC, BE

Nicoleta Cucu Laurenciu, Radbout University, NL

A Track

Bahar Farahani, Shahid Beheshti University, IR

Jo Vliegen, KU Leuven, BE

T Track

Mohammad Hasan Ahmadilivani, Tallinn University of Technology, EE

Johann Knechtel, New York University Abu Dhabi, AE

E Track

BaekGyu Kim, Daegu Gyeongbuk Institute of Science & Technology, KR

Yasmina Abdeddaim, University Gustave Eiffel, CNRS, LIGM, FR